The new segments are a direct response to prevailing trends and emerging needs in electronics manufacturing today. As the largest trade and exchange platform for Asia's electronics manufacturing and SMT industries, the annual NEPCON China event introduces numerous new innovations to the regional market. To date, 95 percent of available booths have been sold.

NEPCON China 2012 is expected to attract 500 leading electronics manufacturing companies, including Assembléon, Agilent, ASM (Siplace), Sony, Hitachi, Samsung, Panasonic, Fuji, Henkel, Yamaha, Tokyo Juki and DEK. Additionally, several exhibitors such as IKO, NBK, Mingrui, Fenglei and Kilews will participate in the show for the first time. They will showcase diverse ranges of new technologies, the latest products and advanced solutions for the electronics manufacturing and SMT industries. The exhibits will include SMT technologies and equipment; soldering equipment and materials; test and measurement devices; electronic static discharge (ESD) and purifying machines; bar code scanners and materials; components; electrical and mechanical assembly production equipment; EMS and more. In total, thousands of SMT and electronics manufacturing equipment will be displayed.

To meet the challenges posed by current industry issues and to satisfy future development trends, NEPCON China 2012 will do more than just focus on traditional applications. The event also will launch four new segments: the ESD & Clean Room Segment, the Electronics Manufacturing Automation Segment, the Advanced Electronics Packaging Segment and the Touch Panel Segment.

The Electronic Static Discharge & Clean Room Segment will feature ESD and EPA products. Additionally, it will host electronic static discharge forums in conjunction with key trade associations. These debates will explore advanced local and international ESD concepts and technologies, and focus on combining theory with practice to resolve the ESD challenges that arise during application. To do this, they will analyze representative cases and engage in face-to-face discussion with key industry experts.

The Advanced Electronics Packaging Segment will showcase cutting-edge production technologies and equipment, including semiconductors, LED equipment and power devices. The segment's exhibits will cover packaging equipment, as well as etching tools, plating products and related technologies.

Today, due to rapid technological development, the pressure exerted by rising operational costs (particularly labor costs) and the demand by manufacturers for high flexibility and efficiency, industrial automation solutions are becoming increasingly popular across the entire electronics manufacturing chain.