Hynix to sell back-end equipment to China venture
Hynix Semiconductor Inc said it would sell packaging and testing equipment to a soon-to be formed back-end joint venture in China.
Hynix Semiconductor Inc said on Monday it would sell packaging and testing equipment worth $305 million to a soon-to be formed back-end joint venture in China.
'Hynix will more focus on the core business of front-end manufacturing and extend R&D investment to the fullest,' the world's second-largest maker of computer memory chips said in a statement.